Power chips are attached to outside circuits through packaging, and their efficiency depends on the support of the packaging. In high-power circumstances, power chips are normally packaged as power modules. Chip interconnection describes the electrical connection on the upper surface of the chip, which...

Power chips are attached to outside circuits through packaging, and their efficiency depends on the support of the packaging. In high-power circumstances, power chips are normally packaged as power modules. Chip interconnection describes the electrical...

Power chips are attached to outside circuits through packaging, and their efficiency depends on the support of the packaging. In high-power circumstances, power chips are normally packaged as power modules. Chip interconnection describes the electrical connection on the upper surface of the chip, which is normally light weight aluminum bonding cord in standard components. ^ Traditional power component bundle cross-section Currently, commercial silicon carbide power modules still primarily utilize the packaging technology of this wire-bonded conventional silicon IGBT module. They deal with problems such as big high-frequency parasitical criteria, inadequate warmth dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit using silicon carbide semiconductors. The display of superb performance. In...

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